sm0502 C sm1003 microsemi microwave products 75 technology drive, lowell, ma. 01851, 978-442-5600, fax: 978-937-3748 page 1 tm ? www. microsemi .com copyright ? 2007 rev: 2009-02-25 rohs com p liant versions control devices surface mount C melf pin diodes . descri pt i on this line of melf high power pi n diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. the melf ceramic package has square end terminations which are ideal for surface mount and pick and place operations. the pin diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in mtbfs of greater than one million hours. rohs compliant versions of these products meet rohs requirements per eu directive 2002/95/ec. the standard terminal finish is gold unless otherwise specified. consult the factory if you have special requirements. appli cat i on s the melf diodes are used as switching, attenuating and phase shifting elements from hf through 2 ghz and have breakdown voltage ratings up to 500 volts. non-magnetic 1 .cer-met. (melfs) are also used as switching elements in mri (magnetic resonance imaging). conventional magnetic melf packages are used in cellular, beam steering units (tel ephone via satellites) surface mount applications, and filter switch banks for frequency hopping radios. appli cat i on s/ben efi t s ? designed for low loss C low distortion applications ? switch C filter bank ? t/r control ? attenuators ? mri switching absolu t e m ax i m u m rat i n gs at 2 5 o c (u n less ot h erwi se speci fi ed) rating symbol value unit maximum leakage current @80% of minimum rated v b i r 500 na forward current (1us pulse) i f 1 a storage temperature t stg -55 to +150 oc operating temperature t op -55 to +150 oc k ey feat u res ? non-magnetic 1 versions ideal for mri applications ? very low inductance, full face bonding ? hi-rel hermetic design ? surface mount devices available in tape and reel ? rohs compliant 2 versions available sm0502 C sm1003 important: for the most current data, consult our website : www.microsemi.com specifications are subject to change, c onsult factory for the latest information. these devices are esd sensitive and mu st be handled using esd precautions. 1 non magnetic refers to any products that are designed with low and ultra low magnetic materials for use in mri systems 2 rohs versions are supplied with a matte tin finish. downloaded from: http:///
sm0502 C sm1003 microsemi microwave products 75 technology drive, lowell, ma. 01851, 978-442-5600, fax: 978-937-3748 page 2 tm ? www. microsemi .com copyright ? 2007 rev: 2009-02-25 rohs com p liant versions control devices surface mount C melf pin diodes electrical parameters @ 25 ? c (unless otherwise specified) model number v b (v) i r =10 a (min) c t (pf) 1 @50v (max) r s ( ? ) 2 @100 ma (max) r s ( ? ) 2 @200 ma (typ) t l (us) . (typ) ? p ( ? c/w) thermal resistance (max) sm0502 C m1 500 0.5 0.7 0.55 1.0 35 sm0504 C m1 500 0.6 0.6 0.45 1.5 20 sm0508 C m1 500 0.9 0.4 0.25 2.0 15 sm0509 C m1 500 1.2 0.35 0.2 2.5 15 sm0511 C m1 500 1.25 0.3 0.15 3.0 15 sm0512 C m1 500 1.5 0.25 0.12 3.5 15 sm1002 C m1 50 1.2 0.75@50ma 0.2 4.0 15 sm1003 C m1 35 1.2 @20v 0.5@10ma 0.1 0.6 25 notes: 1- capacitance (c t ) is measured at f = 1 mhz 2- series resistance (r s ) is measured at f = 100 mhz rohs and mri models base model rohs compliant pn non-mag. / rohs pn sm0502 C m1 smx0502 C m1 smx0502mr C m1 sm0504 C m1 smx0504 C m1 smx0504mr C m1 sm0508 C m1 smx0508 C m1 smx0508mr C m1 sm0509 C m1 smx0509 C m1 smx0509mr C m1 sm0511 C m1 smx0511 C m1 smx0511mr C m1 sm0512 C m1 smx0512 C m1 smx0512mr C m1 sm1002 C m1 smx1002 C m1 smx1002mr C m1 sm1003 C m1 smx1003 C m1 smx1003mr C m1 e e l l e e c c t t r r i i c c a a l l downloaded from: http:///
sm0502 C sm1003 microsemi microwave products 75 technology drive, lowell, ma. 01851, 978-442-5600, fax: 978-937-3748 page 3 tm ? www. microsemi .com copyright ? 2007 rev: 2009-02-25 rohs com p liant versions control devices surface mount C melf pin diodes typical rs cureves package style m1 solder pad layout g g r r a a p p h h s s downloaded from: http:///
|
